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Publicação
Direct Laser Writing
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| 27.49 MB | Adobe PDF |
Orientador(es)
Resumo(s)
Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost-effective, high-resolution material synthesis and conversion. Concurrently, lasers participate in the patterning and assembly of functional geometries in several fields of application, of which electronics stand out. In this review, recent advances and strategies based on DLW for electronics microfabrication are surveyed and outlined, based on laser material growth strategies. First, the main DLW parameters influencing material synthesis and transformation mechanisms are summarized, aimed at selective, tailored writing of conductive and semiconducting materials. Additive and transformative DLW processing mechanisms are discussed, to open space to explore several categories of materials directly synthesized or transformed for electronics microfabrication. These include metallic conductors, metal oxides, transition metal chalcogenides and carbides, laser-induced graphene, and their mixtures. By accessing a wide range of material types, DLW-based electronic applications are explored, including processing components, energy harvesting and storage, sensing, and bioelectronics. The expanded capability of lasers to participate in multiple fabrication steps at different implementation levels, from material engineering to device processing, indicates their future applicability to next-generation electronics, where more accessible, green microfabrication approaches integrate lasers as comprehensive tools.
Descrição
Funding Information: This work was partially financed by FEDER funds through the COMPETE 2020 Programme and National funds from FCT – Fundação para a Ciência e a Tecnologia, I.P., in the scope of projects LA/P/0037/2020, UIDP/50025/2020 and UIDB/50025/2020 of the Associate Laboratory Institute of Nanostructures, Nanomodelling and Nanofabrication – i3N and project LIGHEART 2022.08597.PTDC. This work was also partially supported by the European Union's Horizon 2020 Research and Innovation Programme under Grant Agreement number 952169 (SYNERGY, H2020-WIDESPREAD-2020-5, CSA), 101008701 (EMERGE, H2020-INFRAIA-2020-1) and 101096021 (SUPERIOT, HORIZON-JU-SNS-2022-STREAM-B-01-03). T.P., M.M., and S.S also acknowledge funding from FCT – Fundação para a Ciência e a Tecnologia, through PhD grants 2020.08606.BD, 2022.13806.BD and SFRH/BD/149751/2019. J.C. and E.C. would also like to acknowledge funding from the National Foundation for Science and Technology through the project GAMBIT (2022.01493.PTDC). J.C. also acknowledges the funding from FCT – Fundação para a Ciência e a Tecnologia through the Individual CEEC contract (CEECIND/00880/2018) and thanks the EMERGIA Junta de Andalucia program (EMC21_00174). Publisher Copyright: © 2024 The Authors. Advanced Materials published by Wiley-VCH GmbH.
Palavras-chave
bioelectronics Direct laser writing electronics laser-material processing lasers material synthesis General Materials Science Mechanics of Materials Mechanical Engineering SDG 9 - Industry, Innovation, and Infrastructure