| Nome: | Descrição: | Tamanho: | Formato: | |
|---|---|---|---|---|
| 4.76 MB | Adobe PDF |
Autores
Orientador(es)
Resumo(s)
Em litografia, o comprimento de onda da luz utilizada para gravar padrões num fotorresiste
está fortemente relacionado com o tamanho mínimo das estruturas que são possíveis de
obter. Nas últimas décadas, tem sido utilizada litografia com luz na gama do ultravioleta
profundo (DUVL), capaz de atingir resoluções de cerca de 40 nm, onde por resolução
se entende a menor dimensão geométrica que pode ser fielmente reproduzida num
fotorresiste. No entanto, a litografia com luz na gama do extremo ultravioleta (EUVL),
que utiliza um comprimento de onda de 13,5 nm (92 eV), tem sido introduzida como a
tecnologia predominante no fabrico de semicondutores.
Um dos principais obstáculos à transição entre DUVL e EUVL reside na necessidade
de desenvolver fotorresistes compatíveis com este novo processo. Os fotorresistes am-
plificados quimicamente (CARs) mostram ser uma solução viável para DUVL, porém, a
transferência para EUVL tem sido problemática devido à radiação altamente energética
desta nova técnica e à baixa secção eficaz de absorção de EUV. Face a estes obstáculos, a
inclusão de metais em novos sistemas de fotorresistes tem sido um dos focos primários
dos fabricantes.
Está estudado que os eletrões secundários de baixa energia gerados a partir da fotoio-
nização das moléculas do filme são responsáveis pela maioria das reações no fotorresiste.
Com este fenómeno em mente, esta dissertação de mestrado procura estudar as interações
de dois agregados oxo-metálicos diferentes com eletrões de baixa energia, bem como
os fragmentos iónicos provenientes de tal reação, de modo a expandir o conhecimento
existente sobre sistemas de fotorresistes viáveis para a realização de EUVL.
Experimentalmente, foi utilizado um espetrómetro de massa de tempo-de-voo com refletrão ortogonal, em combinação com um monocromador trocoidal de eletrões, destinado
a colimar o feixe de eletrões que intersecta o feixe molecular. Para além da identificação
dos fragmentos iónicos através da obtenção de um espetro de massa das moléculas, serão
calculadas as energias de aparecimento, para catiões, e ressonâncias, para aniões.
In lithography, the wavelength of the light used to pattern a photoresist is strongly related to the minimum feature size achievable. In recent decades, Deep Ultraviolet Lithography (DUVL) has been used, capable of reaching resolutions of about 40 nm, where resolution is defined as the smallest geometric dimension that can be faithfully reproduced in a photoresist. However, Extreme Ultraviolet Lithography (EUVL), which uses a wavelength of 13.5 nm (92 eV), has been introduced as the predominant technology in semiconductor manufacturing. One of the main obstacles to the transition between DUVL and EUVL lies in the need to develop photoresists compatible with this new process. Chemically Amplified Resists (CARs) prove to be a viable solution for DUVL; however, the transfer to EUVL has been problematic due to the highly energetic radiation of this new technique and the low EUV absorption cross-section. Facing these obstacles, the inclusion of metals in new photoresist systems has been one of the primary focuses of manufacturers. It is established that low-energy secondary electrons generated from the photoioniza- tion of the film molecules are responsible for the majority of reactions in the photoresist. With this phenomenon in mind, this Master’s dissertation seeks to study the interactions of two different metal-oxo clusters with low-energy electrons, as well as the ionic fragments resulting from such reactions, in order to expand existing knowledge on viable photoresist systems for EUVL implementation. Experimentally, an orthogonal reflectron time-of-flight mass spectrometer was used in combination with a trochoidal electron monochromator, intended to collimate the electron beam that intersects the molecular beam. In addition to identifying ionic fragments by obtaining the mass spectrum of the molecules, appearance energies will be calculated for cations, and resonances for anions.
In lithography, the wavelength of the light used to pattern a photoresist is strongly related to the minimum feature size achievable. In recent decades, Deep Ultraviolet Lithography (DUVL) has been used, capable of reaching resolutions of about 40 nm, where resolution is defined as the smallest geometric dimension that can be faithfully reproduced in a photoresist. However, Extreme Ultraviolet Lithography (EUVL), which uses a wavelength of 13.5 nm (92 eV), has been introduced as the predominant technology in semiconductor manufacturing. One of the main obstacles to the transition between DUVL and EUVL lies in the need to develop photoresists compatible with this new process. Chemically Amplified Resists (CARs) prove to be a viable solution for DUVL; however, the transfer to EUVL has been problematic due to the highly energetic radiation of this new technique and the low EUV absorption cross-section. Facing these obstacles, the inclusion of metals in new photoresist systems has been one of the primary focuses of manufacturers. It is established that low-energy secondary electrons generated from the photoioniza- tion of the film molecules are responsible for the majority of reactions in the photoresist. With this phenomenon in mind, this Master’s dissertation seeks to study the interactions of two different metal-oxo clusters with low-energy electrons, as well as the ionic fragments resulting from such reactions, in order to expand existing knowledge on viable photoresist systems for EUVL implementation. Experimentally, an orthogonal reflectron time-of-flight mass spectrometer was used in combination with a trochoidal electron monochromator, intended to collimate the electron beam that intersects the molecular beam. In addition to identifying ionic fragments by obtaining the mass spectrum of the molecules, appearance energies will be calculated for cations, and resonances for anions.
Descrição
Palavras-chave
EUVL Fotorresiste DEA Ionização Monocromador trocoidal tempo- de-voo
